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Mitsubishi Materials (MMC) has developed MOFC-HR (Mitsubishi Oxygen-Free Copper–Heat Resistance), an entirely new material that combines the conductive properties of pure copper and the strength and heat resistance of copper alloys. MOFC-HR retains the highest electrical and thermal conductivity of conventional oxygen-free copper (OFC), but boasts a 25% increase in strength with minimal degradation up to 400℃, 150℃ higher than OFC. In addition, spring properties never seen with conventional OFC are now available. MOFC-HR is attracting attention in EV (electric-vehicle) and next-generation energy applications where materials that can carry high currents and dissipate heat are required. Visit the official press release for details including the contact for inquiries.